# Applied Materials x BE Semiconductor Industries Hybrid Bonding Partnership: partnership

Canonical ID: `c8fdf1fb-a460-4ba0-bfe1-6e5b879414a9`

Applied Materials purchased 9 percent of BE Semiconductor Industries (Besi) shares in April 2025, building on four years of successful collaboration on hybrid bonding technology for advanced semiconductor packaging. The companies have co-developed an integrated hybrid bonding system combining Applied's wafer processing expertise with Besi's die placement and assembly solutions for high-volume manufacturing.

- **Type:** development
- **Status:** active
- **Verification posture:** verified

## Parties (2)

- [Applied Materials](https://registry.deploy.report/companies/applied-materials.md) technology provider
- BE Semiconductor Industries _(off-registry)_ co developer

## Sources (1)

1. https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-announces-strategic-investment-be


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