{"id":"59540430-33ee-404a-8921-39b23177cdec","name":"Biren Technology","slug":"biren-technology","description":"Shanghai-based fabless semiconductor company designing general-purpose GPUs (GPGPUs) for AI training and HPC. Flagship BR100 chip (77B transistors, 7nm TSMC) targeted performance parity with Nvidia's A100. Added to the US Bureau of Industry and Security Entity List in October 2023, cutting off access to TSMC advanced nodes. Listed on Hong Kong Stock Exchange (06082.HK) in January 2026.","status":"public","founded":2019,"hq":"Shanghai, China","hqLat":null,"hqLng":null,"hqGeocodedAt":null,"hqAddress":null,"hqPrecision":null,"website":"birentech.com","fundingTotal":null,"type":"brain","roles":[],"reviewStatus":"reviewed","heatIndex":0,"lifecycleState":"active","supersededByCompanyId":null,"sources":[{"url":"https://en.wikipedia.org/wiki/Biren_Technology","title":"Biren Technology","sourceName":"Wikipedia"}],"keyFacts":[{"label":"CEO","value":"Zhang Wen (founder, chairman & CEO; former president at SenseTime)"},{"label":"Co-founder","value":"Xu Lingjie (left post-sanctions 2023); Jiao Guofang (ex-Qualcomm, ex-Huawei)"},{"label":"Stock listing","value":"Hong Kong Stock Exchange (06082.HK); IPO Jan 2 2026 — shares opened HK$35.70 vs HK$19.60 offer (119% pop)"},{"label":"US Entity List","value":"Added October 17 2023 by US BIS; TSMC halted manufacturing of BR100"},{"label":"Manufacturing","value":"TSMC 7nm CoWoS (pre-sanction); exploring SMIC as domestic alternative"},{"label":"2024 Revenue","value":"~400 million yuan / ~$55M (Reuters-reported; company operates at a loss)"},{"label":"Key product","value":"BR100 GPGPU (77B transistors, 7nm, 256 TFLOPS FP32, 1024 TFLOPS BF16); BR104 single-die PCIe variant; Biren 106/110/166 chips"},{"label":"Software stack","value":"BIRENSUPA (CUDA-compatible; supports PyTorch, TensorFlow, PaddlePaddle)"},{"label":"Deployments","value":"Chips deployed in intelligent computing centers of China Mobile, China Telecom, ZTE, Shanghai AI Lab"},{"label":"Key investors","value":"Qiming Venture Partners (founding investor), Guangdong state-backed fund, Shanghai SSCI"}],"aliases":["Biren","壁仞科技"],"collisionRisk":"low","reviewNote":null,"atsProvider":null,"atsSlug":null,"factoryLocations":null,"manufacturingCapacity":null,"orgType":null,"burnSignal":null,"litigationEvents":null,"insurancePostureDisclosed":null,"unitEconomicsDisclosed":null,"tickerSymbol":"06082","stockExchange":"HKEX","secCik":null,"revenueUsd":null,"revenueBasis":null,"revenueAsOf":null,"employeeCount":null,"employeeCountBasis":null,"employeeCountAsOf":null,"marketCapUsd":null,"marketCapAsOf":null,"marketCapSource":null,"createdAt":"2026-08-24T23:13:03.554Z","updatedAt":"2026-08-25T16:35:05.552Z","jsonLd":{"@context":"https://schema.org","@type":"Organization","@id":"https://registry.deploy.report/companies/biren-technology","url":"https://registry.deploy.report/companies/biren-technology","name":"Biren Technology","alternateName":["Biren","壁仞科技"],"description":"Shanghai-based fabless semiconductor company designing general-purpose GPUs (GPGPUs) for AI training and HPC. Flagship BR100 chip (77B transistors, 7nm TSMC) targeted performance parity with Nvidia's A100. Added to the US Bureau of Industry and Security Entity List in October 2023, cutting off access to TSMC advanced nodes. Listed on Hong Kong Stock Exchange (06082.HK) in January 2026.","identifier":"59540430-33ee-404a-8921-39b23177cdec","foundingDate":"2019","address":"Shanghai, China","publisher":{"@id":"https://deploy.report/#organization"}},"framework_metadata":{"framework_schema_version":"0.1.0","verification_status":"verified","maturity_stage":null,"lifecycle_state":null,"architectural_position":{"cohort":null,"sub_cohorts":[]},"within_cohort_verified_vs_claimed_pair":null,"cap_flags":[],"verification_depth":{"sources_count":1,"primary_source_types":["knowledge-base"]}}}