{"id":"cfa57b48-4b0a-4ec0-a76b-80ff8df92349","name":"Broadcom","slug":"broadcom","description":"Semiconductor and infrastructure software. WiFi, Bluetooth, storage, and networking chips. Public company ([Nasdaq](/companies/nasdaq): AVGO).","status":"public","founded":1991,"hq":"Palo Alto, CA","hqLat":37.4443293,"hqLng":-122.1598465,"hqGeocodedAt":"2026-08-05T14:23:08.305Z","hqAddress":null,"hqPrecision":null,"website":"broadcom.com","fundingTotal":null,"type":"both","roles":[],"reviewStatus":"reviewed","heatIndex":56,"lifecycleState":"active","supersededByCompanyId":null,"sources":[{"url":"https://www.broadcom.com/","title":"Broadcom"},{"url":"https://www.broadcom.com/company/about-us","title":"About Us - Broadcom","sourceName":"Broadcom"},{"url":"https://www.broadcom.com/company/news/product-releases/64236","title":"Broadcom Announces Extended Partnership with Meta for MTIA","sourceName":"Broadcom"},{"url":"https://news.bloomberglaw.com/tech-and-telecom-law/broadcom-starts-amassing-60-billion-to-fund-chips-for-anthropic","title":"Broadcom Starts Amassing $60 Billion to Fund Chips for Anthropic","sourceName":"Bloomberg Law (Bloomberg News)","publishedAt":"2026-10-02"},{"url":"https://qz.com/broadcom-60-billion-debt-financing-anthropic-ai-chips-100226","title":"Broadcom raises $60 billion in debt to fund Anthropic AI chips","sourceName":"Quartz","publishedAt":"2026-10-02"},{"url":"https://www.channelnewsasia.com/business/exclusive-broadcom-lend-anthropic-up-42-billion-lease-its-chips-filing-says-6424136","title":"Exclusive-Broadcom to lend Anthropic up to $42 billion to lease its chips, filing says","sourceName":"CNA (Reuters)","publishedAt":"2026-10"},{"url":"https://www.wsj.com/tech/oracle-broadcom-and-spacex-seek-blockbuster-debt-deals-to-pay-for-ai-chips-848e8032","title":"Oracle, Broadcom and SpaceX Seek Blockbuster Debt Deals to Pay for AI Chips","sourceName":"The Wall Street Journal","publishedAt":"2026-10-07"},{"url":"https://squawknews.com/news/442062-broadcom-explores-50b-financing-for-openai-custom-ai-chips","title":"Broadcom explores $50B+ financing for OpenAI custom AI chips","sourceName":"SquawkNews","publishedAt":"2026-10-07"},{"url":"https://en.oninvest.com/article/broadcom-seeks-more-than-50-billion-in-funding-for-openai-s-ai-chips-wsj","title":"Broadcom Seeks More Than $50 Billion in Funding for OpenAI's AI Chips (WSJ)","sourceName":"Oninvest","publishedAt":"2026-10-08"},{"url":"https://www.ft.com/content/cb4034e1-475f-40b9-a5f9-256e91aacb89","title":"Anthropic offers Blackstone double-digit yield in latest chip financing","sourceName":"Financial Times","publishedAt":"2026-10-16"},{"url":"https://www.investing.com/news/company-news/anthropic-offers-blackstone-over-10-yield-in-60b-ai-chip-financing--ft-reports-4955122","title":"Anthropic offers Blackstone over 10% yield in $60B AI chip financing, FT reports","sourceName":"Investing.com","publishedAt":"2026-10-16"},{"url":"https://www.sec.gov/Archives/edgar/data/2130357/000162828026067168/anthropicpbc-sx1.htm","title":"Anthropic, PBC Form S-1 registration statement","sourceName":"Anthropic (SEC filing)","publishedAt":"2026-10-26"},{"url":"https://investors.broadcom.com/news-releases/news-release-details/bank-america-blackstone-citi-and-morgan-stanley-announce","title":"Bank of America, Blackstone, Citi and Morgan Stanley Announce Landmark $63 Billion Financing Structure to Enable AI Compute Capacity in Partnership with Broadcom","sourceName":"Broadcom","publishedAt":"2026-10-26"},{"url":"https://investors.broadcom.com/static-files/f4bda79d-cc66-4748-919b-40d08c658f2d","title":"$63 Billion Transaction to Enable Deployment of AI Compute Capacity for Anthropic (overview)","sourceName":"Broadcom","publishedAt":"2026-10-26"},{"url":"https://www.morganstanley.com/press-releases/bank-of-america--blackstone--citi-and-morgan-stanley-announce-la","title":"Bank of America, Blackstone, Citi and Morgan Stanley Announce Landmark $63 Billion Financing Structure","sourceName":"Morgan Stanley","publishedAt":"2026-10-26"},{"url":"https://www.investing.com/news/stock-market-news/wall-street-banks-blackstone-line-up-63-billion-to-finance-broadcom-chips-for-anthropic-4973662","title":"Wall Street banks, Blackstone line up $63 billion to finance Broadcom AI chips for Anthropic","sourceName":"Reuters (via Investing.com)","publishedAt":"2026-10-26"}],"keyFacts":[{"label":"Business (company-claimed)","value":"Semiconductors (networking, WiFi, Bluetooth, storage, broadband, servers, industrial) plus private cloud, mainframe, cybersecurity and SAN software."},{"label":"R&D spend (company-claimed)","value":"$11B in fiscal 2025."},{"label":"Meta MTIA partnership (company-claimed)","value":"Apr 2026: Extended multi-year, multi-generation partnership supporting Meta's MTIA training and inference chips, with plans through 2029."},{"label":"Anthropic chip financing (reported, Oct 2026)","value":"Broadcom's bank syndicate is gathering $60B of AI chip financing benefiting Anthropic: a $42B senior tranche and an $18B junior tranche led by Blackstone. Not finalized."},{"label":"Anthropic loan (reported, Oct 2026)","value":"Per Anthropic's IPO filing, Broadcom agreed to lend it up to $42B, possibly convertible to shares, toward a $125.2B five-year TPU capacity lease from 2027."},{"label":"OpenAI chip financing (reported, Oct 2026)","value":"Seeking over $50B tied to custom chips co-developed with OpenAI, with Apollo and Blackstone in talks, per the WSJ. Early talks; size may change."},{"label":"OpenAI chip program (reported, Oct 2026)","value":"Internally called Nexus, with first- and second-generation chips codenamed Jalapeno and Serrano; could fund several gigawatts and close by year-end."},{"label":"Anthropic senior debt guarantee (reported, Oct 2026)","value":"FT reports the roughly $42B of senior debt in Anthropic's $60B Project North Star TPU financing is guaranteed by Broadcom."},{"label":"Anthropic TPU leases (counterparty filing, Oct 2026)","value":"Anthropic's S-1: five-year master equipment leases total about $161.2B of rent excluding interest, starting as equipment is ready for service. More capacity comes online from 2027."},{"label":"Anthropic $63B SPV financing (company-stated, Oct 2026)","value":"BofA, Citi and Morgan Stanley arrange first lien and Blackstone second lien for an SPV that buys Broadcom XPUs and networking to lease to Anthropic. Deliveries from 2027."},{"label":"SPV residual value support (company-stated, Oct 2026)","value":"Broadcom backs the SPV for the first lien amount. It puts peak exposure at $43B, falling to zero over five years of lease payments, with no direct cash outlay."}],"aliases":[],"collisionRisk":"low","reviewNote":"Reviewed 2026-07-14: source-gated bulk flip (non-empty sources[]). Ben-approved.","atsProvider":null,"atsSlug":null,"factoryLocations":null,"manufacturingCapacity":null,"orgType":null,"burnSignal":null,"litigationEvents":null,"insurancePostureDisclosed":null,"unitEconomicsDisclosed":null,"tickerSymbol":"AVGO","stockExchange":"NASDAQ","secCik":null,"revenueUsd":null,"revenueBasis":null,"revenueAsOf":null,"employeeCount":null,"employeeCountBasis":null,"employeeCountAsOf":null,"marketCapUsd":null,"marketCapAsOf":null,"marketCapSource":null,"createdAt":"2026-06-08T03:58:23.148Z","updatedAt":"2026-10-27T01:57:30.382Z","jsonLd":{"@context":"https://schema.org","@type":"Organization","@id":"https://registry.deploy.report/companies/broadcom","url":"https://registry.deploy.report/companies/broadcom","name":"Broadcom","description":"Semiconductor and infrastructure software. WiFi, Bluetooth, storage, and networking chips. Public company ([Nasdaq](/companies/nasdaq): AVGO).","identifier":"cfa57b48-4b0a-4ec0-a76b-80ff8df92349","foundingDate":"1991","address":"Palo Alto, CA","publisher":{"@id":"https://deploy.report/#organization"}},"framework_metadata":{"framework_schema_version":"0.1.0","verification_status":"verified","maturity_stage":null,"lifecycle_state":null,"architectural_position":{"cohort":null,"sub_cohorts":[]},"within_cohort_verified_vs_claimed_pair":null,"cap_flags":[],"verification_depth":{"sources_count":16,"primary_source_types":["primary-company-ir","primary-sec-filing","secondary-established-publication"]}}}