{"id":"c8fdf1fb-a460-4ba0-bfe1-6e5b879414a9","slug":"applied-materials-x-be-semiconductor-industries-hybrid-bonding-partnership","name":"Applied Materials x BE Semiconductor Industries Hybrid Bonding Partnership","partnershipType":"development","status":"active","announcedDate":null,"startDate":null,"endDate":null,"summary":"Applied Materials purchased 9 percent of BE Semiconductor Industries (Besi) shares in April 2025, building on four years of successful collaboration on hybrid bonding technology for advanced semiconductor packaging. The companies have co-developed an integrated hybrid bonding system combining Applied's wafer processing expertise with Besi's die placement and assembly solutions for high-volume manufacturing.","sources":[{"url":"https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-announces-strategic-investment-be","title":"Applied Materials Announces a Strategic Investment in BE Semiconductor Industries","sourceName":"Applied Materials Investor Relations"}],"verificationPosture":"verified","reviewStatus":"reviewed","createdAt":"2026-08-22T18:10:41.612Z","updatedAt":"2026-08-22T19:21:48.102Z","parties":[{"id":"6b709457-921f-445c-bae5-da011908f0b7","partnershipId":"c8fdf1fb-a460-4ba0-bfe1-6e5b879414a9","companyId":"77dffca2-fdff-4a24-bfde-2d8ae207cb2e","externalName":null,"role":"technology_provider","createdAt":"2026-08-22T18:10:41.983Z","company":{"id":"77dffca2-fdff-4a24-bfde-2d8ae207cb2e","slug":"applied-materials","name":"Applied Materials"}},{"id":"3fc66b13-c2e7-44ea-b381-096b982bf617","partnershipId":"c8fdf1fb-a460-4ba0-bfe1-6e5b879414a9","companyId":null,"externalName":"BE Semiconductor Industries","role":"co_developer","createdAt":"2026-08-22T18:10:42.353Z","company":null}]}