Patent
US 12,560,514
Sensing assembly with multiple sensing sites and through-hole configurations for analyte/property detection. Applicable to precision robotic sensing environments.
USPTO · granted · granted 2026-02-24
Machine-readable surfaces
- Markdown mirror: /patents/us12560514-adi-sensor-assembly.md
- JSON-LD: embedded in this page’s head
- REST API: /v1/patents/68bdc013-064d-4632-a026-cd932dd08a60
- Revision history: /patents/us12560514-adi-sensor-assembly/history
- Data documentation: /data
- Query this programmatically: Deploy MCP
Key facts
- Jurisdiction
- uspto
- Status
- granted
- Number
- US 12,560,514
- Filing date
- 2023-05-04
- Grant date
- 2026-02-24
- Verification posture
- verified
Parties (1)
- assignee · Analog Devices (verified)
Sources (1)
Deploy Watch
Track this patent.
We notify you on related litigations, assignments, settlements, or other patents in the same family.
Identity
68bdc013-064d-4632-a026-cd932dd08a60