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Chip comparison

Cambricon MLU370-X8 vs Cerebras WSE-3 (Wafer-Scale Engine 3)

Side-by-side specs

Straight from each vendor's datasheet. Winner in bold: higher throughput, memory, or transistor count; lower power draw or price. Sparse (2:4) throughput roughly doubles the FP8/INT8 numbers shown.

FieldCambricon MLU370-X8Cerebras WSE-3 (Wafer-Scale Engine 3)
Process nodeTSMC N7TSMC N5
Transistors (B)4000
Die size46225 mm²
TDP250 W23000 W
Memory48 GB LPDDR544 GB on-die SRAM
Memory bandwidth21,000,000 GB/s
FP16 (dense)96 TFLOPS62,500 TFLOPS
INT8 (dense)256 TOPS
Form factorPCIewafer-scale (single-wafer system)
Announced2022-03-252024-03-13
Released2024-04-01

Robots running Cambricon MLU370-X8

No robots publicly running it yet.

Robots running Cerebras WSE-3 (Wafer-Scale Engine 3)

No robots publicly running it yet.

Data centers with Cambricon MLU370-X8

No data centers publicly running it yet.

Data centers with Cerebras WSE-3 (Wafer-Scale Engine 3)

No data centers publicly running it yet.

Common questions

Cambricon MLU370-X8 vs Cerebras WSE-3 (Wafer-Scale Engine 3): which is faster for training?

Cerebras WSE-3 (Wafer-Scale Engine 3) has 651.04x the dense FP16/BF16 throughput of the other (Cambricon MLU370-X8: 96 TFLOPS; Cerebras WSE-3 (Wafer-Scale Engine 3): 62,500 TFLOPS). Real-world training speed also depends on memory bandwidth, interconnect, and software stack: see the spec diff for those inputs.

Cambricon MLU370-X8 vs Cerebras WSE-3 (Wafer-Scale Engine 3): which has more memory?

Cambricon MLU370-X8 carries more HBM (Cambricon MLU370-X8: 48 GB LPDDR5; Cerebras WSE-3 (Wafer-Scale Engine 3): 44 GB on-die SRAM). Memory capacity sets the largest model that fits on one chip without partitioning; memory bandwidth sets inference throughput.

Cambricon MLU370-X8 vs Cerebras WSE-3 (Wafer-Scale Engine 3): which is more power-efficient?

Dense FP16/BF16 TFLOPS per watt: Cambricon MLU370-X8 0.38 (96 ÷ 250 W); Cerebras WSE-3 (Wafer-Scale Engine 3) 2.72 (62,500 ÷ 23000 W). Cerebras WSE-3 (Wafer-Scale Engine 3) wins at the die level; system-level efficiency also depends on cooling and interconnect.

See also: every chip comparison · Cambricon MLU370-X8 full page · Cerebras WSE-3 (Wafer-Scale Engine 3) full page.