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Chip comparison

Cerebras WSE-3 (Wafer-Scale Engine 3) vs Huawei Ascend 910C

Side-by-side specs

Straight from each vendor's datasheet. Winner in bold: higher throughput, memory, or transistor count; lower power draw or price. Sparse (2:4) throughput roughly doubles the FP8/INT8 numbers shown.

FieldCerebras WSE-3 (Wafer-Scale Engine 3)Huawei Ascend 910C
Process nodeTSMC N5SMIC N+2 (~7nm)
Transistors (B)4000
Die size46225 mm²
TDP23000 W500 W
Memory44 GB on-die SRAM128 GB HBM2e
Memory bandwidth21,000,000 GB/s3,200 GB/s
FP16 (dense)62,500 TFLOPS800 TFLOPS
BF16 (dense)800 TFLOPS
INT8 (dense)1,600 TOPS
Form factorwafer-scale (single-wafer system)OAM
Announced2024-03-132024-09-19
Released2024-04-012025-01-01

Robots running Cerebras WSE-3 (Wafer-Scale Engine 3)

No robots publicly running it yet.

Robots running Huawei Ascend 910C

No robots publicly running it yet.

Data centers with Cerebras WSE-3 (Wafer-Scale Engine 3)

No data centers publicly running it yet.

Data centers with Huawei Ascend 910C

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Common questions

Cerebras WSE-3 (Wafer-Scale Engine 3) vs Huawei Ascend 910C: which is faster for training?

Cerebras WSE-3 (Wafer-Scale Engine 3) has 78.13x the dense FP16/BF16 throughput of the other (Cerebras WSE-3 (Wafer-Scale Engine 3): 62,500 TFLOPS; Huawei Ascend 910C: 800 TFLOPS). Real-world training speed also depends on memory bandwidth, interconnect, and software stack: see the spec diff for those inputs.

Cerebras WSE-3 (Wafer-Scale Engine 3) vs Huawei Ascend 910C: which has more memory?

Huawei Ascend 910C carries more HBM (Cerebras WSE-3 (Wafer-Scale Engine 3): 44 GB on-die SRAM; Huawei Ascend 910C: 128 GB HBM2e). Memory capacity sets the largest model that fits on one chip without partitioning; memory bandwidth sets inference throughput.

Cerebras WSE-3 (Wafer-Scale Engine 3) vs Huawei Ascend 910C: which is more power-efficient?

Dense FP16/BF16 TFLOPS per watt: Cerebras WSE-3 (Wafer-Scale Engine 3) 2.72 (62,500 ÷ 23000 W); Huawei Ascend 910C 1.60 (800 ÷ 500 W). Cerebras WSE-3 (Wafer-Scale Engine 3) wins at the die level; system-level efficiency also depends on cooling and interconnect.

See also: every chip comparison · Cerebras WSE-3 (Wafer-Scale Engine 3) full page · Huawei Ascend 910C full page.