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David Huang

President, Thermal Solutions Division at Boyd Corporation, responsible for all aspects of Boyd's Thermal business including strategy, operations, product design, field application engineering, and sales. Also leads Boyd's Asia Pacific operations and business development. Joined Boyd in 2017 through its acquisition of Aavid Thermalloy, where he served as Vice President and General Manager of its Telecom and Consumer business division.

Expertise in P&L management, private-equity-sponsored company leadership, and global manufacturing. Holds an MBA from the University of Massachusetts and a BS in Materials Management from Hefei Institute of Technology in China.

Chinese-American · 2 current roles

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Current roles (2)

Sources (3)

  1. https://www.boydcorp.com/thermal.html
  2. https://www.boydcorp.com/about-boyd/leadership.html
  3. https://www.emr-online.com/eaton-eaton-completes-acquisition-of-leading-liquid-cooling-solutions-provider-boyd-thermal-creating-an-industry-leading-grid-to-chip-solution-for-data-centers/

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