DEPLOYDatabase

Company

Broadcom

Semiconductor and infrastructure software.

Founded
1991
Status
Public

Overview

Semiconductor and infrastructure software. WiFi, Bluetooth, storage, and networking chips. Public company (Nasdaq: AVGO).

Reality check

Business (company-claimed)

Semiconductors (networking, WiFi, Bluetooth, storage, broadband, servers, industrial) plus private cloud, mainframe, cybersecurity and SAN software.

R&D spend (company-claimed)

$11B in fiscal 2025.

Meta MTIA partnership (company-claimed)

Apr 2026: Extended multi-year, multi-generation partnership supporting Meta's MTIA training and inference chips, with plans through 2029.

Verified record

Verified deployments
None on file
Active incidents
None on file

Key facts

Anthropic chip financing (reported, Oct 2026)

Broadcom's bank syndicate is gathering $60B of AI chip financing benefiting Anthropic: a $42B senior tranche and an $18B junior tranche led by Blackstone. Not finalized.

Anthropic loan (reported, Oct 2026)

Per Anthropic's IPO filing, Broadcom agreed to lend it up to $42B, possibly convertible to shares, toward a $125.2B five-year TPU capacity lease from 2027.

OpenAI chip financing (reported, Oct 2026)

Seeking over $50B tied to custom chips co-developed with OpenAI, with Apollo and Blackstone in talks, per the WSJ. Early talks; size may change.

OpenAI chip program (reported, Oct 2026)

Internally called Nexus, with first- and second-generation chips codenamed Jalapeno and Serrano; could fund several gigawatts and close by year-end.

Anthropic senior debt guarantee (reported, Oct 2026)

FT reports the roughly $42B of senior debt in Anthropic's $60B Project North Star TPU financing is guaranteed by Broadcom.

Anthropic TPU leases (counterparty filing, Oct 2026)

Anthropic's S-1: five-year master equipment leases total about $161.2B of rent excluding interest, starting as equipment is ready for service. More capacity comes online from 2027.

Anthropic $63B SPV financing (company-stated, Oct 2026)

BofA, Citi and Morgan Stanley arrange first lien and Blackstone second lien for an SPV that buys Broadcom XPUs and networking to lease to Anthropic. Deliveries from 2027.

SPV residual value support (company-stated, Oct 2026)

Broadcom backs the SPV for the first lien amount. It puts peak exposure at $43B, falling to zero over five years of lease payments, with no direct cash outlay.

Data & sources

Company filings

1

Press releases

2

News coverage

2

Web sources

11

16 sources backing this record.View all →

Partnerships

Every company Broadcom has built with, alongside the ones only announced in a press release.

3 total3 operating

Most-frequent partners

  1. 1Apple1× joint3 total
  2. 2OpenAI1× joint5 total
  3. 3Samsung Electronics1× joint4 total

Most recent

Broadcom on the deployment map

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Relationships

Current leadership (4)

  • Hock Tan President & CEOsecondary-verified
  • Hock E. Tan President & Chief Executive Officersecondary-verified
  • Charlie Kawwas President, Semiconductor Solutions Groupsecondary-verified
  • Yuan Xing Lee Vice President, Central Engineeringsecondary-verified

Founders (2)

See all founders across the registry →

Former / Previously (2)

Safety record

No incidents on record for Broadcom.

Only active incidents are counted. Retracted incidents are excluded from this summary but remain reachable at their canonical URLs.

Full safety record: incidents, sourcing, and exposure data →

Recent coverage

Broadcom in third-party press

Peer companies

Mentioned on (13)

Registry pages whose text names Broadcom.